| DC Field | Value | Language |
|---|
| dc.contributor.author | Jordanov, Nikola Stefanov | - |
| dc.contributor.author | Andonova, Anna Stoynova | - |
| dc.contributor.author | Atanasova, Natasha Georgieva | - |
| dc.date.accessioned | 2018-08-28T14:47:10Z | - |
| dc.date.available | 2018-08-28T14:47:10Z | - |
| dc.date.issued | 2002 | - |
| dc.identifier.citation | Jordanov N. S. Reliability improvement in consequence of investigation PCB silver electrochemical migrations / Nikola Stefanov Jordanov, Anna Stoynova Andonova, Natasha Georgieva Atanasova // Вісник Національного університету "Львівська політехніка". – 2002. – № 458 : Елементи теорії та прилади твердотілої електроніки. – С. 138–144. – Bibliography: 4 titles. | uk_UA |
| dc.identifier.uri | https://ena.lpnu.ua/handle/ntb/42542 | - |
| dc.description.abstract | Looking for a compromise between high functionality and convenient and effective materials the silver has got many proved and achievements qualities for PCB. The main problem in using as a constructive materials its high disposition of migration. The investigation of a concrete type of migration between silver conductors is the goal of the paper. For this purpose an investigation techniques is presented to qualifying PCB structures. Some test structures are designed and produced and experimental results are results are analyzed. | uk_UA |
| dc.language.iso | en | uk_UA |
| dc.publisher | Видавництво Національного університету "Львівська політехніка" | uk_UA |
| dc.subject | Silver electrochemicalmigration | uk_UA |
| dc.subject | Electrochemisty | uk_UA |
| dc.subject | Conductive films | uk_UA |
| dc.subject | Reliability | uk_UA |
| dc.subject | Failure analysis | uk_UA |
| dc.subject | Multichip modules | uk_UA |
| dc.title | Reliability improvement in consequence of investigation PCB silver electrochemical migrations | uk_UA |
| dc.type | Article | uk_UA |
| dc.rights.holder | © Nikola Stefanov Jordanov, Anna Stoynova Andonova, Natasha Georgieva Atanasova, 2002 | uk_UA |
| dc.contributor.affiliation | Technical University of Sofia, Dept. of Microelectronics | uk_UA |
| dc.coverage.country | UA | uk_UA |
| dc.format.pages | 138–144 | - |
| dc.relation.references | [1] Nikola Jordanov, Natasha Atanasova, Anna Andonova, Dimiter Dimitrov, “Processing Induced Material Interactions Determining the Reliability of PCB”, Proceedings of the Int. Conference Electonics’02”, 2002, Sozopol, Bulgaria (to be printed). [2] G. Harsányia,” Material design aspects of high reliability, high density interconnections”, Microelectronics Reliability, 2001, Vol. 41, No. 2, pp.229-237. [3] P. Bojta, P. Németh and G. Harsányi, “Searching for appropriate humidity accelerated migration reliability tests”, Microelectronics and Reliability.1996, Vol. 36, No.4, pp. 534. [4] David E. Mortin, Jane G. Krolewski, Michael J. Cushing,” Consideration of component failure mechanisms in the reliability assessment of electronic equipment-addressing the constant failure rate assumption”, Microelectronics and Reliability, 1996,Vol.36, No. 4, pp. 534-535. | uk_UA |
| dc.citation.journalTitle | Елементи теорії та прилади твердотілої електроніки | - |
| dc.coverage.placename | Львів | uk_UA |
| Appears in Collections: | Елементи теорії та прилади твердотілої електроніки. – 2002. – №458
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