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Please use this identifier to cite or link to this item: https://oldena.lpnu.ua/handle/ntb/42487
Title: Survey of quality and reliability problems in design of MEMS
Authors: Andonova, Anna Stoynova
Atanasova, Natasha Georgieva
Affiliation: Technical University – Sofia, Bulgaria
Bibliographic description (Ukraine): Andonova A. S. Survey of quality and reliability problems in design of MEMS / A. S. Andonova, N. G. Atanasova // Вісник Національного університету "Львівська політехніка". – 2002. – № 458 : Елементи теорії та прилади твердотілої електроніки. – С. 38–43. – Bibliography: 4 titles.
Journal/Collection: Елементи теорії та прилади твердотілої електроніки
Issue Date: 2002
Publisher: Видавництво Національного університету "Львівська політехніка"
Country (code): UA
Place of the edition/event: Львів
Keywords: MEMS
Quality
Reliability
Failure Modes
Fault Simulation
Number of pages: 38–43
Abstract: The interdisciplinary nature of MicroElectroMechanical Systems (MEMS) utilizes design engineering and manufacturing expertise from a wide and diverse range of technical areas. In order to produce a high reliability and quality MEMS we must not only examine the device itself, but must also examine the entire process surrounding the devices, from conception to finish. This means that the process must be qualified, with the supplier fully investigated, the design verified, and the packaging certified. The paper presents a survey of the various aspects of MEMS, with emphasis on its reliability and quality features in the design phase.
URI: https://ena.lpnu.ua/handle/ntb/42487
Copyright owner: © Anna Stoynova Andonova, Natasha Georgieva Atanasova, 2002
References (Ukraine): [1] G. Kovacs, Micromachined Transducers Sourcebook, McGraw-Hill, New York, NY, 1998. [2] S. Sze, Semiconductor Sensors, Wiley Inter-Science, New York, 1994 [3] D. M. Tanner at all, “Reliability Test of a Surface Micromachined Microengine Using SHiMMeR” Proceedings of SPIE, Vol. 3224, PP 14-23, 1997. [4] W. Kalita, J. Potenski, “Activity of the Rzeszow Centre in the Field of Microelectronics and Packaging-Investigations and Production”, Proceedings of IMAPS, Poland 2001, pp.13-20.
Content type: Article
Appears in Collections:Елементи теорії та прилади твердотілої електроніки. – 2002. – №458

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