https://oldena.lpnu.ua/handle/ntb/42484| Title: | Analysis of ceramic chip capacitors at high frequency |
| Authors: | Golumbeanu, Virgil Svasta, Paul Ionescu, Ciprian |
| Affiliation: | University Politehnica Bucharest, Romania |
| Bibliographic description (Ukraine): | Golumbeanu V. Analysis of ceramic chip capacitors at high frequency / V. Golumbeanu, P. Svasta, C. Ionescu // Вісник Національного університету "Львівська політехніка". – 2002. – № 458 : Елементи теорії та прилади твердотілої електроніки. – С. 25–31. – Bibliography: 9 titles. |
| Journal/Collection: | Елементи теорії та прилади твердотілої електроніки |
| Issue Date: | 2002 |
| Publisher: | Видавництво Національного університету "Львівська політехніка" |
| Country (code): | UA |
| Place of the edition/event: | Львів |
| Keywords: | ceramic capacitors equivalent series resistance equivalent series inductance equivalent circuits impedance |
| Number of pages: | 25–31 |
| Abstract: | The dimensions of monolithic ceramic capacitors today becomes very small and they presents good performance at high frequency. It is used in various high frequency circuits for impedance matching, DC block, filter, bypass and decoupling functions. For the best performance in these applications , low equivalent series resistance and equivalent series inductance is required. This parameters are analyzed in the paper for multilayer ceramic chip capacitors. Using an impedance analyzer and SPICE simulations the impedance of capacitors at high frequency is presented. |
| URI: | https://ena.lpnu.ua/handle/ntb/42484 |
| Copyright owner: | © Virgil Golumbeanu, Paul Svasta, Ciprian Ionescu, 2002 |
| References (Ukraine): | [1] M. Montrose, "Printed Circuit Board Design Techniques for EMC Compliance", IEEE Press, New York, 1996. [2] M. Montrose, "EMC and the Printed Circuit Board. Design, Theory, and Layout Made Simple", IEEE Press, New York, 1999. [3] Y. Sakabe, M. Hayashi, T. Ozaki, J. Canner, “High Frequency Measurement of Multilayer Ceramic Capacitors”, IEEE trans. on CPMTEMC, vol. 19, no.1, 1996, pp 7 - 14. [4] P. Claiton, "Effectiveness of Multiple Decoupling Capacitors", IEEE Trans on EMC, vol.34, nr.2, 1992, pp. 130-133. [5] L. Smith, R. Anderson, D. Forehand, T. Pelc, T. Roy, "Power Distribution System Design Methodology and Capacitor Selection for Modern CMOS Technology", IEEE Trans. on Advanced Packaging, vol. 22, nr3, 1999, pp. 284-291. [6] Vishay, “Monolithic Ceramic Chip Capacitor”, www:vishay.com. [7] AVX, “Chip Capacitors”, www:avx.com. [8] C. Val, L. Bui, M. Petit, “High Density Surface Mounting Power Supply”, ISHM Proc., Baltimore, 1989, pp. 670-677. [9] P. Svasta, V.Golumbeanu, et all, "Training Program in Electronic Passive Components Education", Proc. ECTC, San Diego, 2002, pp. 780-786. |
| Content type: | Article |
| Appears in Collections: | Елементи теорії та прилади твердотілої електроніки. – 2002. – №458 |
| File | Description | Size | Format | |
|---|---|---|---|---|
| 6_25-31.pdf | 56.73 kB | Adobe PDF | View/Open |
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